| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a structure for dissipating heat generated from a mounted semiconductor element efficiently to the outside through a printed wiring board and connection electrodes, or the like, buried in an insulating substrate. <P>SOLUTION: The semiconductor device is constituted by stacking a printed wiring board mounting a semiconductor element on an insulating substrate 1' fixed with a plurality of balls for external connection terminals. Conductive balls for dissipating heat are fixed to the marginal part other than a region where the balls for external connection terminals are formed on the rear surface of the insulating substrate 1'. More specifically, the rear surface of the substrate is divided into a region 14' of the balls for external connection terminals and a region 15' of the conductive balls for dissipating heat. Since heat generated from the semiconductor element can be released efficiently to the insulating substrate fixed with external connection terminals, temperature rise of the semiconductor device itself is prevented and deterioration of characteristics can be prevented in a semiconductor element, e.g. a DRAM, where temperature rise causes deterioration in memory holding characteristics. <P>COPYRIGHT: (C)2003,JPO |
