发明名称 ONE-PACK MOISTURE-CURABLE EPOXY RESIN COMPOSITION
摘要 A one-pack moisture curable epoxy resin composition which comprises a ketimine compound represented by a chemical formula (2) which is synthesized from a carbonyl compound represented by a chemical formula (1) in which two same or different alkyl groups each having 2 to 6 carbon atoms are bonded to a carbonyl group and an amine compound having at least one primary amino group in a molecule, and an epoxy resin, and which has excellent curing properties and good storage stability: <CHEM> wherein R1 is an alkyl group having 2 to 6 carbon atoms, and R2 is an alkyl group having 2 to 6 carbon atoms, <CHEM> wherein R3 is an organic group, R4 is an alkyl group having 2 to 6 carbon atoms, R5 is an alkyl group having 2 to 6 carbon atoms, and n is an integer of 1 or more.
申请公布号 KR20030061425(A) 申请公布日期 2003.07.18
申请号 KR20037007675 申请日期 2003.06.09
申请人 发明人
分类号 C08G59/50;C07F9/38;C08G59/40;C08L63/00 主分类号 C08G59/50
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