SHEET MATERIAL FOR CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, AND MULTILAYER BOARD AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a sheet material for a circuit board by which the mounting quantity of electric components can be increased and the circuit board can be made small with high reliability, by mounting the electric components inside an insulation layer without complicated manufacturing processes.

SOLUTION: On at least surface of a resin layer 4 in the stage B, as a transfer base 6 having conductor circuits 5 on which electric components 10 are mounted is laminated on the resin layer 4 in a manner wherein the conductor circuits 5 and the electric components 10 are opposed to the resin layer 4, the conductor circuits 5 and the electric components 10 are embedded in the resin layer 4. The transfer base 6 is delaminated from the resin layer 4 while the conductor circuits 5 are left in the resin layer 4 to transfer them to the resin layer 4 in a manner wherein the outer surface of the resin layer 4 is flush with the exposed faces of the conductor circuits 5.

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