| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a manufacturing method for a semiconductor device in which a period until shipping of products of semiconductor devices in which software desired by a user is selected and a mask ROM circuit based on a program code is formed can be shortened and the semiconductor device. <P>SOLUTION: A CPU circuit section and an I/O circuit section being peripheral of internal circuits are manufactured on one chip by wafer process (S1a), while a mask ROM circuit section is manufactured on the other chip by wafer process (S1b). The CPU circuit section and the I/O circuit section being peripheral of internal circuits are manufactured by the last process by wafer process of S1a, the mask ROM circuit section is manufactured by previous process of program selection process, a manufacture line of a process after program selection process manufacturing using a mask made by selection of software by a customer and obtaining a program code is made an exclusive line, and manufacturing is performed at high speed. After that, products are shipped through an assembly process (S3) and a test process (S4). <P>COPYRIGHT: (C)2003,JPO</p> |
