发明名称 WAFER-GRIPPING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a wafer-gripping device that easily builds forks, built in multistages and adjusts pitches. SOLUTION: The device is constituted by a fork for transferring a wafer, a base 2 to which the fork is fixed, and a frame to which the base 2 is fitted. A plurality of bases 2, arranged in the frame in multistage, are so supported with positioning pins that each pin 2 can oscillate separately. After the finishing of pitch adjustment for the fork, the base 2 is fixed to the frame with a fixing bolt 9. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003203962(A) 申请公布日期 2003.07.18
申请号 JP20020000949 申请日期 2002.01.07
申请人 KONDO SEISAKUSHO:KK 发明人 FUJIEDA SHUNJI
分类号 B25J15/00;B25J15/08;B65G49/07;H01L21/677;H01L21/68;(IPC1-7):H01L21/68 主分类号 B25J15/00
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