发明名称 MANUFACTURING METHOD FOR DOUBLE-SIDED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To fine the wiring pattern of a double-sided wiring board. SOLUTION: Light-sensitive glass 2 is used as the substrate material of a double-sided wiring board 50, the light-sensitive glass 2 is partially exposed for forming a through hole 3, the light-sensitive glass 2 after the formation of the through hole 3 is crystallized, and a copper film layer 6 is formed on the innerwall surface of the through hole 3 of the crystallized light-sensitive glass 2 and the front and rear surfaces of the light-sensitive glass 2, thus forming the through hole having a small diameter in the light-sensitive glass 2, at the same time, reducing the difference in thermal coefficient of expansion between the light-sensitive glass 2 and the copper film layer 6, and avoiding a failure such as burnout for forming a fine wiring pattern. Additionally, the light-sensitive glass 2 is crystallized, thus improving mechanical strength and heat resistance, and enabling the inhibition of ion migration or the like. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003204152(A) 申请公布日期 2003.07.18
申请号 JP20020377945 申请日期 2002.12.26
申请人 HOYA CORP 发明人 FUSHIE TAKASHI;KAGATSUME TAKESHI;MATSUI SHIGEKAZU
分类号 H05K3/40;H01L23/15;H05K1/03;H05K3/00;(IPC1-7):H05K3/40 主分类号 H05K3/40
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