| 摘要 |
PROBLEM TO BE SOLVED: To provide resin encapsulation, capable of facilitating a manufacturing process and improved in the reliability of connection upon mounting, a resin encapsulating semiconductor device and the manufacturing method thereof. SOLUTION: The thermal expansion coefficient of the sealing resin is specified so as to be 8-10 ppm/°C and the Young's modulus of the same is specified to be 1.8-2 GPa. COPYRIGHT: (C)2003,JPO
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