| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin sealed semiconductor device exhibiting stabilized electric characteristics and excellent high frequency characteristics even if the size and the thickness are reduced, and its manufacturing method. <P>SOLUTION: The resin sealed semiconductor device comprises a die pad 106, signal leads 102, earth connection leads 103 connected with the die pad 106, a semiconductor chip 201 having electrode pads for earth, thin metal wires 202, and a resin 203 for sealing the die pad 106 and the semiconductor chip 201 and further sealing the signal leads 102 and the earth connection leads 103 while exposing the lower part thereof as external terminals. Since the earth connection leads 103 are connected with the electrode pads for earth, the resin sealed semiconductor device is stabilized electrically. Furthermore, interference of high frequency signals passing through the signal leads 102 is suppressed by the die pad 106 and the earth connection leads. <P>COPYRIGHT: (C)2003,JPO |
