| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce fracture aberration occurred in filling a transparent resin in order to restrain deterioration of a semiconductor laser within a non-airtight package. <P>SOLUTION: It places a parallel plate 201 between a semiconductor laser 100 and an objective lens 102, fills room between the semiconductor laser and the parallel plate 201 with a transparent resin 105, and reduces the wave aberration restraining the deterioration of the semiconductor laser. <P>COPYRIGHT: (C)2003,JPO |
