发明名称 PACKAGING STRUCTURE AND PRODUCTION METHOD FOR HIGH FREQUENCY SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To stably make satisfactory the alignment of a dielectric and a high frequency transmission line even in mass-production. <P>SOLUTION: In a high frequency circuit having substrate having the high frequency transmission line and a dielectric resonator provided on the substrate to be electromagnetically coupled to the high frequency transmission line, a hole or hollow portion is formed on one part of the substrate and the dielectric resonator is embedded in this hole or the hollow portion. Besides, for similar purposes, the high frequency circuit having the dielectric resonator is produced by a process for forming the high frequency transmission line on the substrate, a process for forming the hole or the hollow portion partially on the substrate and a process for embedding the dielectric resonator in the hole formed on the surface of the substrate. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003204201(A) 申请公布日期 2003.07.18
申请号 JP20020001296 申请日期 2002.01.08
申请人 HITACHI LTD 发明人 SASADA YOSHIYUKI
分类号 C04B35/00;H01P1/20;H01P7/10;H01P11/00;H03B5/18;H04B1/40 主分类号 C04B35/00
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