| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition very excellent in sensitivity, adhesion, chemical resistance, flexibility and property of not contaminating a plating bath and a method for producing a printed wiring board using the composition. <P>SOLUTION: The photosensitive resin composition contains (A) a binder polymer, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in one molecule and (C2') an onium salt compound, wherein (A) the binder polymer is a binder polymer containing (A') styrene or a styrene derivative as a copolymerized component or (B) the photopolymerizable compound is (B') a bisphenol A type (meth)acrylate compound or (B") a photopolymerizable compound having a urethane bond. A photosensitive element produced using the photosensitive resin composition is provided. In the method for producing the printed wiring board, the photosensitive element is used. <P>COPYRIGHT: (C)2003,JPO |
