| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To over come a problem that simultaneous noise and EMI noise are increased in a multilayer circuit board mounting electronic components which operate at high speed. <P>SOLUTION: This multilayer circuit board 1 includes a chip capacitor 6 in an insulation layer 2c which is an integrated capacitor formed between a power supply wiring layer 4 and a ground wiring layer 5, so as to be opposed within an insulation board 2 comprising a plurality of insulation layers 2a-2e laminated with each other. The chip capacitor 6 is arranged in the insulation layer 2c, one terminal electrode of the chip capacitor 6 is connected to the power supply wiring layer 4, and another terminal electrode is connected to the ground wiring layer 5. The end of the power supply wiring layer 4 is positioned inside the end of ground wiring layer 5. Since the inductance component of a through-conductor for connecting the chip capacitor 6 to the power supply wiring layer 4 and the ground wiring layer 5 is reduced. At the same time, the electromagnetic coupling between the power supply wiring layer 4 and the ground wiring layer 5 is suppressed low, concentration of high frequency current caused by electromagnetic coupling at their ends is lowered, and EMI noise generating from their ends can be drastically reduced. <P>COPYRIGHT: (C)2003,JPO</p> |
