| 摘要 |
PROBLEM TO BE SOLVED: To provide a reliable, flexible multilayer circuit board having a struc ture in which a stress is effectively relieved, and wirings and via-holes are hard to break to a dynamic stress in a reel-to-reel technique and a thermal stress in the use for connection of a semiconductor integrated circuit element to a printed circuit board. SOLUTION: In the multilayer circuit board in which insulation layers are arranged between a plurality of matallic conductive layers, at least one insulation layer has a laminated structure consisting of a high elastic modulus layer and a low elastic modulus layer. The high elastic modulus layer has a thickness of 10 to 50μm and a elastic modulus of 200 to 12,000 MPa at room temperature, and the low elastic modulus layer has a thickness of 5 to 30μm and a elastic modulus of 10 to 1,000 MPa. COPYRIGHT: (C)2003,JPO |
