| 摘要 |
PROBLEM TO BE SOLVED: To obtain a sealing method capable of preventing run of wire or island shift, upon sealing a semiconductor element by a resin. SOLUTION: Tablet resin 11 is charged into a pocket 10, equipped in a lower die 8 and a middle die 9 for sealing the lower side is set, then, an upper die is disposed thereon to press them and pour the resin into the cavity of the lower die 8, to form the lower side 4 of a package. Next, a lead frame 4, on which the semiconductor element 2 is mounted, is set on the lower die 8 comprising the lower side 4 of the package, then a middle die 6 for sealing the upper side is mounted and the upper die 7 is superposed thereon to press them. The tablet resin 19 is melted, by heating the same to pure the molten resin through the runner 15 and the gate 5 of the upper side sealing middle die 6 and seal the upper side of the package, then the resin is cured, whereby resin sealing is completed. COPYRIGHT: (C)2003,JPO |
