发明名称 METHOD AND APPARATUS FOR FORMING SEMICONDUCTOR THIN FILM
摘要 PROBLEM TO BE SOLVED: To improve nonuniformity of the grain diameter of polycrystalline silicon, resulting from unevenness of thickness of an amorphous silicon film in the crystallization process, to reform the amorphous silicon into the polycrystalline silicon through irradiation of an energy beam. SOLUTION: At irradiation of an amorphous silicon thin film, formed on an insulated substrate 11, with a laser beam generated from a laser beam generator 33, the film thickness of the amorphous silicon thin film previously measured for each of a plurality of blocks is stored to a storage device 35. The energy beam is irradiated through adjustment to the optimum energy density in block units, in order to obtain the polycrystalline silicon thin film of the desired grain diameter, based on this measured value. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003203863(A) 申请公布日期 2003.07.18
申请号 JP20020002569 申请日期 2002.01.09
申请人 TOSHIBA CORP 发明人 YOTSUMOTO SHIGEYUKI
分类号 H01L21/20;H01L21/268;H01L21/336;H01L29/786;(IPC1-7):H01L21/20 主分类号 H01L21/20
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