| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problems that there is the failure of crossing for the changeover of input terminals on a user side, a package outer shape becomes large and superiority cannot be demonstrated even when the miniaturization of a chip advances in a conventional two-switch package. <P>SOLUTION: One lead is extended so as to bypass other patterns under the chip, the chip is fixed onto the pattern and an electrode pad for the input terminal is connected to the lead exposed from the chip. Thus, a circuit in which practical RF signal routes are crossed is realized within the package of CSP, and the miniaturization of a device at the time of mounting on the user side is realized. <P>COPYRIGHT: (C)2003,JPO |
