| 摘要 |
PROBLEM TO BE SOLVED: To provide a porous film for a wiring board that has excellent heat resistance and a suitable linear thermal expansion coefficient, in which a thermosetting resin is preferably impregnated, and a wiring board prepreg using the same. SOLUTION: This porous film for the wiring board comprises a repeating unit containing a m-phenylene group of 80 mol% or more in total, is made of an aromatic polyamide having a glass transition temperature Tg of 190-350°C, and has a porosity of 30-80% and the coefficient of linear thermal expansion of 0-200 ppm/°C in the Z direction. The wiring board prepreg comprises such a porous film and a thermosetting resin half hardened substance impregnated in pores of it. COPYRIGHT: (C)2003,JPO |
