| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component cooling body that prevents an Sn-Pb alloy layer from being melted again in a flow method soldering process, and can inhibit a void based on the remelting and cracks accompanied by the void, and to provide a soldering method using the cooling body. SOLUTION: An electronic component cooling body 1 is used and has a forming hose member 2 having a shape that can be placed to a body 11 of an electronic component 10, and a cooling member 3 that is deformed by dead weight for coming into contact with a lead section 12 of the electronic component 10 while being mounted to the forming hose member 2 for placing to the electronic component body 11 with the forming hose member 2. In this case, the cooling body 1 is circularly placed at the electronic component 10 on an electronic board B while the cooling body 1 is being cooled to a temperature range of, for example, 5 to 10°C, the electronic component 10 where the cooling body 1 is fitted is continuously carried in a flow soldering furnace with an electronic board B, and the lead section 12 of the electronic component 10 is soldered to the electronic board B in the furnace. COPYRIGHT: (C)2003,JPO
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