| 摘要 |
PROBLEM TO BE SOLVED: To provide a ultrasonic bonding machine, capable of applying ultrasonic vibration in the vertical directions to a bonding surface, with a ultrasonic horn which is attached to the machine free from being influenced for the vibration of the ultrasonic horn, thus preventing vibration damping, and improving vibration efficiency. SOLUTION: The method of the ultrasonic bonding machine comprises the steps of accommodating a ultrasonic horn 6, having a ultrasonic transducer 7 mounted on one end surface thereof in a machine body 23; contacting an edge portion of the ultrasonic horn to an IC chip 1 on the bonding surface of a packaging substrate 3; firmly bonding the IC chip on the packaging substrate, by applying the ultrasonic vibration in the vertical directions relative to the bonding surface while pressing the IC chip; integrally providing a flange section 10 therewith along a peripheral surface, at a predetermined portion of the ultrasonic horn; providing a plurality of mounting holes in this flange section; and securing the ultrasonic horn to the machine body, by inserting fixing screws 11 into the mounting holes. COPYRIGHT: (C)2003,JPO
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