| 摘要 |
<p>Electromagnetic, especially infrared, detector comprises a radiation detection circuit (8) optionally on a support, and a reading circuit (7) connected electrically to the detection circuit on a substrate (21). The circuits are connected to each other by indium or tin/lead alloy microspheres, which alone occupy the connection zone between the circuits. Preferred Features: The support (21) for the radiation detection unit is transparent to the radiation or absorbs it to a limited extent. The reading circuit (7) is intended for processing some of the electrical signals emitted by the detection circuit, and is connected to a monolithic germanium substrate (21), which, in turn, is connected directly or indirectly to a cold source. An Independent claim is given for a method for production of the electromagnetic, particularly infrared, radiation detector described above. The method involves reducing the thickness of the reading circuit (7) before or after connecting it to the detection circuit (8), providing a reading circuit substrate (21) able to withstand stress, in order to limit the effects of thermal expansion resulting from both linear deformation and bending operating at the level of the reading circuit during different temperature cycles, and connecting the reading circuit (7) to the detection circuit (8) without using adhesives or filling materials in the connection zone. The reading circuit (7) is connected to the substrate (21) by an epoxy adhesive.</p> |
