发明名称 |
Multilayer printed wiring board and method of manufacturing the same |
摘要 |
A structure of a multilayer printed wiring board having a wiring lead-out port can be easily formed. A large number of products can be easily manufactured with good size reproducibility. A method of manufacturing the same is also are disclosed. The multilayer printed wiring board is characterized by having a signal circuit conductor perfectly covered by an earth circuit in its inside and a wiring lead-out port. A signal circuit conductor having a branch pattern is preferable. The multilayer printed wiring board is manufactured by selectively etching the copper of a cladding sheet manufactured by bonding a copper foil to a nickel foil with 0.1-3% reduction and forming a signal circuit conductor perfectly covered by an earth circuit and the wiring lead-out port.
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申请公布号 |
US2003133277(A1) |
申请公布日期 |
2003.07.17 |
申请号 |
US20020168403 |
申请日期 |
2002.11.27 |
申请人 |
SAIJO KINJI;YOSHIDA KAZUO;OKAMOTO HIROAKI;OHSAWA SHINJI |
发明人 |
SAIJO KINJI;YOSHIDA KAZUO;OKAMOTO HIROAKI;OHSAWA SHINJI |
分类号 |
H05K1/02;H05K3/06;H05K3/46;(IPC1-7):H01R9/00 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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