发明名称 |
MEMORY DEVICE PACKAGING INCLUDING STACKED PASSIVE DEVICES AND METHOD FOR MAKING THE SAME |
摘要 |
In accordance with one embodiment of the invention, a memory device package includes an integrated circuit die having a memory array and at least one passive component mounted to the integrated circuit component. |
申请公布号 |
WO03058718(A1) |
申请公布日期 |
2003.07.17 |
申请号 |
WO2002US41310 |
申请日期 |
2002.12.19 |
申请人 |
INTEL CORPORATION |
发明人 |
LOPEZ, CHARLES;FOEHRINGER, RICHARD;RABADAM, ELEANOR |
分类号 |
H01L23/50;H01L23/64;H01L25/16 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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