发明名称 |
Electrolytic processing device and substrate processing apparatus |
摘要 |
There is provided an electrolytic processing device including: a processing electrode brought into contact with or close to a workpiece; a feeding electrode for supplying electricity to the workpiece; an ion exchanger disposed in at least one of the spaces between the workpiece and the processing electrode, and between the workpiece and the feeding electrode; a power source for applying a voltage between the processing electrode and the feeding electrode; and a liquid supply section or supplying a liquid to the space between the workpiece and at least one of the processing electrode and the feeding electrode, in which the ion exchanger is present. A substrate processing apparatus having the electrolytic processing device is also provided. |
申请公布号 |
US2003132103(A1) |
申请公布日期 |
2003.07.17 |
申请号 |
US20020296333 |
申请日期 |
2002.11.22 |
申请人 |
KOBATA ITSUKI;SHIRAKASHI MITSUHIKO;KUMEKAWA MASAYUKI;SAITO TAKAYUKI;TOMA YASUSHI;SUZUKI TSUKURU;YAMADA KAORU;MAKITA YUJI |
发明人 |
KOBATA ITSUKI;SHIRAKASHI MITSUHIKO;KUMEKAWA MASAYUKI;SAITO TAKAYUKI;TOMA YASUSHI;SUZUKI TSUKURU;YAMADA KAORU;MAKITA YUJI |
分类号 |
B24B37/00;B23H3/00;B23H3/08;B23H3/10;B23H5/08;B24B37/04;C25D17/00;C25F7/00;H01L21/00;H01L21/304;H01L21/306;H01L21/3063;(IPC1-7):C25D17/00 |
主分类号 |
B24B37/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|