发明名称 Microsuspension assemblies for direct access storage devices
摘要 Embodiments include a method for forming a head suspension assembly. A spacer layer is formed in or on a silicon wafer. A transfer film including an opening defining the shape of a slider support membrane is provided, and the opening is filled with a resin material. The transfer film with the resin material therein is positioned over the silicon wafer so that at least a portion of the resin material is positioned adjacent to the spacer layer. The resin material is baked to form a glassy carbon material. The spacer layer is etched to form a trench in the silicon wafer adjacent to the glassy carbon material, and a slider is positioned on the glassy carbon material over the trench.
申请公布号 US2003133229(A1) 申请公布日期 2003.07.17
申请号 US20020047229 申请日期 2002.01.14
申请人 IBM 发明人 LILLE JEFFREY S
分类号 G11B5/48;G11B5/60;(IPC1-7):G11B5/48 主分类号 G11B5/48
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