发明名称 Solutions of metal-comprising materials
摘要 In one aspect, the invention encompasses a semiconductor processing method of forming a metal-comprising layer over a substrate. A substrate is provided within a reaction chamber, and a source of a metal-comprising precursor is provided external to the reaction chamber. The metal-comprising precursor comprises a metal coordinated with at least one Lewis base to form a complex having a stoichiometric ratio of the at least one Lewis base to the metal. An amount of the at least one Lewis base is distributed within the source to an amount that is in excess of the stoichiometric ratio.. At least some of the metal-comprising precursor is transported from the source to the reaction chamber. A metal is deposited from the metal-comprising precursor and onto the substrate within the reaction chamber. In another aspect, the invention encompasses a method of storing a metal-comprising material. A metal-comprising material is dispersed within a solution. The metal-comprising material comprises a complex having the stoichiometric form (Y)xM(Q)z; wherein M is a metal, Y is a first ligand, x is from 0 to 4, Q is a Lewis base, and z is from 1 to 6. An amount of Q is dispersed within the solution to an excess over the stoichiometric ratio of Q to M in the complex.
申请公布号 US2003134465(A1) 申请公布日期 2003.07.17
申请号 US20030336087 申请日期 2003.01.03
申请人 UHLENBROCK STEFAN;VAARTSTRA BRIAN A. 发明人 UHLENBROCK STEFAN;VAARTSTRA BRIAN A.
分类号 C23C16/18;C23C16/40;F17C11/00;H01L21/02;H01L21/285;(IPC1-7):H01L21/824 主分类号 C23C16/18
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