发明名称 |
Method and apparatus for heating and colling substrates |
摘要 |
A method and apparatus for heating and cooling a substrate are provided. A chamber is provided that comprises a heating mechanism adapted to heat a substrate positioned proximate the heating mechanism, a cooling mechanism spaced from the heating mechanism and adapted to cool a substrate positioned proximate the cooling mechanism, and a transfer mechanism adapted to transfer a substrate between the position proximate the heating mechanism and the position proximate the cooling mechanism.
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申请公布号 |
US2003131495(A1) |
申请公布日期 |
2003.07.17 |
申请号 |
US20020292396 |
申请日期 |
2002.11.12 |
申请人 |
MORAD RATSON;SHIN HO SEON;CHEUNG ROBIN;KOGAN IGOR |
发明人 |
MORAD RATSON;SHIN HO SEON;CHEUNG ROBIN;KOGAN IGOR |
分类号 |
H01L21/31;H01L21/00;H01L21/324;H01L21/677;(IPC1-7):F26B21/06;F26B19/00;F26B25/06;F26B5/04;F26B7/00;F26B3/00 |
主分类号 |
H01L21/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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