POLISHING PAD, PROCESS FOR PRODUCING THE SAME, AND METHOD OF POLISHING

摘要

A polishing pad for polishing the surface of a wafer for semiconductor integrated-circuit formation thereon, which has a high polishing rate, attains evenness of polishing, and has a long life. Preferably, the polishing pad comprises a nonwoven fabric (base) and a non-porous photocured resin filling the spaces among fibers of the nonwoven fabric. It is obtained by: impregnating the base with a photosensitive resin composition comprising at least one member selected from the group consisting of hydrophilic photopolymerizable polymers or oligomers and hydrophilic photopolymerizable monomers; and then photocuring the composition.