发明名称 Semiconductor memory device
摘要 A CMOS-SRAM has a plurality of full CMOS type memory cells (1) and a capacity plate (2). The memory cells (1) are two-dimensionally arranged in the row direction and in the column direction. The capacity plate 2 adds an additional capacity to nodes ND1 and ND2 for storing data in order to reduce soft errors. The capacity plate (2) is common with the plurality of memory cells (1). The capacity plates (2) are separated by every column, that is in the row direction. The capacity plate (2) is connected to a power voltage line VDD so as to simplify the voltage supplying system. When a stand-by failure occurs in the memory cell (1) of a certain column, the memory cell (1) is replaced with a redundant memory cell.
申请公布号 US2003133335(A1) 申请公布日期 2003.07.17
申请号 US20020195381 申请日期 2002.07.16
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 OHBAYASHI SHIGEKI;ISHIGAKI YOSHIYUKI;YOKOYAMA TAKAHIRO
分类号 G11C11/41;G11C11/412;G11C29/00;G11C29/04;H01L21/8244;H01L27/02;H01L27/10;H01L27/11;(IPC1-7):G11C29/00 主分类号 G11C11/41
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