发明名称 Positive resist composition
摘要 A positive resist composition comprising a resin (A), which is decomposed by the action of an acid to increase solubility in an alkali developing solution, containing a structural unit including a group represented by formula (X) defined in the specification and/or a resin (B), which is decomposed by the action of an acid to increase solubility in an alkali developing solution, containing a structural unit including a group represented by formula (Y) defined in the specification, and a resin (C), which is decomposed by the action of an acid to increase solubility in an alkali developing solution, containing a structural unit including a group represented by formula (Q) defined in the specification; and a compound that generates an acid upon irradiation of an actinic ray or radiation.
申请公布号 US2003134221(A1) 申请公布日期 2003.07.17
申请号 US20020285502 申请日期 2002.11.01
申请人 FUJI PHOTO FILM CO., LTD. 发明人 NISHIYAMA FUMIYUKI;FUJIMORI TORU
分类号 G03F7/004;G03F7/039;H01L21/027;(IPC1-7):G03F7/004 主分类号 G03F7/004
代理机构 代理人
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