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发明名称
FLIP-CHIP MOUNTED OPTO-ELECTRONIC CIRCUIT
摘要
<p>A thermo-optic switch comprises two planar waveguide and a heating element couple to at least one of the planar waveguides. The heating element is coupled to a package substrate using solder bumps.</p>
申请公布号
WO2003058326(A2)
申请公布日期
2003.07.17
申请号
US2002039270
申请日期
2002.12.05
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发明人
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