发明名称 Apparatus and method for improving throughput in a cluster tool for semiconductor wafer processing
摘要 An apparatus and method for processing semiconductor wafers is provided. The apparatus comprises a first buffer chamber having a first robot and a second buffer chamber having a second robot. At least one load lock is coupled to the first buffer chamber and the second buffer chamber where the first and second robots can access at least one of said load locks. A plurality of process chambers are disposed about the first and second buffer chambers.
申请公布号 US2003131458(A1) 申请公布日期 2003.07.17
申请号 US20020047549 申请日期 2002.01.15
申请人 APPLIED MATERIALS, INC. 发明人 WANG HOUGONG;YAO GONGDA;XU ZHENG
分类号 H01L21/00;H01L21/677;(IPC1-7):H01L21/00 主分类号 H01L21/00
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