发明名称 Cathode contact pin for an electroplating process
摘要 A cathode contact pin for making electrically conductive contact with a conductive area for carrying out an electrodeposition process including a stem region disposed adjacent a tip region said stem region for interfacing with an electrical source of power for carrying electrical power to said tip region said tip region having a radius of curvature forming a tip region contact surface for contacting a metal contact pad region such that upon contact a contacting portion of the tip region contact surface is confined within an area defined by the metal contact pad region.
申请公布号 US2003132102(A1) 申请公布日期 2003.07.17
申请号 US20020045417 申请日期 2002.01.12
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 LIU CHUNG-SHI;YU CHEN-HUA
分类号 C25D7/12;C25D17/00;(IPC1-7):C25D15/00 主分类号 C25D7/12
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