发明名称 |
Cathode contact pin for an electroplating process |
摘要 |
A cathode contact pin for making electrically conductive contact with a conductive area for carrying out an electrodeposition process including a stem region disposed adjacent a tip region said stem region for interfacing with an electrical source of power for carrying electrical power to said tip region said tip region having a radius of curvature forming a tip region contact surface for contacting a metal contact pad region such that upon contact a contacting portion of the tip region contact surface is confined within an area defined by the metal contact pad region. |
申请公布号 |
US2003132102(A1) |
申请公布日期 |
2003.07.17 |
申请号 |
US20020045417 |
申请日期 |
2002.01.12 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
LIU CHUNG-SHI;YU CHEN-HUA |
分类号 |
C25D7/12;C25D17/00;(IPC1-7):C25D15/00 |
主分类号 |
C25D7/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|