The present invention relates to methods for removing the matrix effects caused by variance in copper concentration and acidity during measurement of the organic additive concentration in a sample copper plating solution.
申请公布号
WO03057947(A1)
申请公布日期
2003.07.17
申请号
WO2002US40450
申请日期
2002.12.19
申请人
ADVANCED TECHNOLOGY MATERIALS, INC.
发明人
KING, MACKENZIE, E.;BELLA, RICHARD;SCHOMBURG, CORY;ROBERTSON, PETER
