发明名称 Compact fluid cooled power converter supporting multiple circuit boards
摘要 A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
申请公布号 US2003133319(A1) 申请公布日期 2003.07.17
申请号 US20020252302 申请日期 2002.12.23
申请人 RADOSEVICH LAWRENCE D.;MEYER ANDREAS A.;BEIHOFF BRUCE C.;KANNENBERG DANIEL G. 发明人 RADOSEVICH LAWRENCE D.;MEYER ANDREAS A.;BEIHOFF BRUCE C.;KANNENBERG DANIEL G.
分类号 B60L11/12;B60L11/18;H02M1/44;H02M7/00;H05K5/00;H05K7/14;H05K7/20;(IPC1-7):H02M1/00 主分类号 B60L11/12
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