ENCAPSULATED COMPONENT WHICH IS SMALL IN TERMS OF HEIGHT AND METHOD FOR PRODUCING THE SAME

摘要

The aim of the invention is to encapsulate components in a simple and reliable manner. To this end, the connection between a chip and a carrier substrate is made by means of bump contacts which are sunk in recesses on the carrier substrate. The component is placed directly on the carrier substrate, especially on a frame defining the component structures on the chip.