发明名称 Lead frame for semiconductor device
摘要 In a lead frame which has second tie bars 4a2, 4b2 in the vicinity of plastic packages 15, first notches 1 are formed along first edges of the second tie bars 4a2, 4b2 (in areas defined on both sides of the inner leads 12a, 12b and to come into contact with a punch during the tie bar cutting step). The first notches 1 prevent troubles associated with close arrangement of the second tie bars 4a2, 4b2 and the plastic packages 15. In addition, second notches 2 are provided along second edges of the second tie bars 4a2, 4b2. These second notches 2 are designed to receive the tips of outer leads 13a, 13b which extend from neighboring plastic packages 15 of the lead frames 100a, 100b.
申请公布号 US2003132512(A1) 申请公布日期 2003.07.17
申请号 US20030340644 申请日期 2003.01.13
申请人 YASUDA YOSHIKI;TAKAKURA HIDEYA 发明人 YASUDA YOSHIKI;TAKAKURA HIDEYA
分类号 H01L23/48;H01L21/56;H01L23/495;H01L23/50;H01L31/167;(IPC1-7):H01L31/023 主分类号 H01L23/48
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