发明名称 |
Chip test device used for testing a chip packaged by ball grid array (BGA) technology |
摘要 |
A chip test device is provided for using a printed circuit board to perform a test process. The printed circuit board includes a pin probe socket having a plurality of pin probe holes. A chip to be tested includes a plurality of protruding electrodes. The chip test device comprises a test base for electrically coupled to the chip to be tested, a plurality of elastic first pin probes, and a test converting board having a first layer with a plurality of pin probe holes coupled to a corresponding one of the protruding electrodes and a second layer with a plurality of second pin probes coupled to a corresponding one of pin probes on the printed circuit board.
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申请公布号 |
US2003134526(A1) |
申请公布日期 |
2003.07.17 |
申请号 |
US20020317103 |
申请日期 |
2002.12.12 |
申请人 |
CHENG WEI-JEN;DENG CHING-WEN |
发明人 |
CHENG WEI-JEN;DENG CHING-WEN |
分类号 |
G01R1/04;G01R1/067;H01R13/24;(IPC1-7):H01R12/00 |
主分类号 |
G01R1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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