发明名称 DEPOSITION OF TUNGSTEN FOR THE FORMATION OF CONFORMAL TUNGSTEN SILICIDE
摘要 <p>A method and apparatus of depositing a tungsten film by cyclical deposition in the formation of tungsten silicide for use in capacitor structures is provided. One embodiment of forming an electrode for a capacitor structure comprises depositing a polysilicon layer over a structure and depositing a tungsten layer over the polysilicon layer by cyclical deposition. The tungsten layer is annealed to form a tungsten silicide layer from the polysilicon layer and the tungsten layer. The tungsten silicide layer acts as one electrode in the capacitor structure. In one aspect, the tungsten silicide layer may be used to form three-dimensional capacitor structures, such as trench capacitors, crown capacitors, and other types of capacitors. In another aspect, the tungsten silicide layer may be used to form capacitor structures which comprise a hemi-spherical silicon grain layer or a rough polysilicon layer.</p>
申请公布号 WO2003058690(A2) 申请公布日期 2003.07.17
申请号 US2002040944 申请日期 2002.12.23
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