METHOD FOR REDUCING DEFECTS OF IMAGE SENSOR CHIP IN BACK GRIND PROCESS

摘要

PURPOSE: A method for reducing defects of an image sensor chip in a back grind process is provided to improve yield of a back grind process by performing a back grind process before a color filter process. CONSTITUTION: A plurality of input and output pads(M1.M2) is formed on an upper portion of a wafer(21a) including unit pixels. A protective layer(23) is formed on the upper portion of the wafer including the input and output pads. A back grind process for a back face of the wafer is performed. An organic material pattern is formed on the protective layer. The organic material pattern includes a color filter(26) and a micro lens(28). The input and output pads are opened by etching selectively the protective layer after the organic material pattern is formed.