| 摘要 |
A method for depositing a feature on a substrate during a device fabrication process, the method comprising the steps of providing a substrate; providing a covering layer on the substrate; providing a surface inhibition layer on the substrate; providing an aperture extending through the surface inhibition layer; providing a via extending from the aperture through the covering layer to the substrate, the via being larger then the aperture such that the surface inhibition layer overhangs the via; depositing a feature material through the aperture onto the substrate to form the feature. <IMAGE> |
