发明名称 |
PHOTO DIODE DETECTOR AND FABRICATING METHOD THEREOF |
摘要 |
PURPOSE: A photo diode detector and a fabricating method thereof are provided to restrain leakage current, and to obtain the desired capacitance by forming thickly a BCB material having a low dielectric constant on an upper portion of an SiNx insulating layer. CONSTITUTION: A u-InO.53GaO.47As layer(22) is grown on an InP substrate(21). A u-Inp layer(23) is formed on the u-InO.53GaO.47As layer. An SiNx insulating layer(25) is formed on the u-Inp layer. An additional insulating layer(26) is formed on the SiNx insulating layer. An opening is formed on a predetermined portion of the additional insulating layer and the SiNx insulating layer. A P-InP layer(24) is formed at the u-Inp layer under the opening. A P-metal layer(28) is formed at an upper portion of the additional insulating layer. An N-metal layer(29) and a non-reflective layer are formed at a lower portion of the InP substrate.
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申请公布号 |
KR20030060309(A) |
申请公布日期 |
2003.07.16 |
申请号 |
KR20020000958 |
申请日期 |
2002.01.08 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
BAEK, JAE MYEONG;YANG, SEUNG GI |
分类号 |
H01L31/10;B32B9/00;H01L21/00;H01L31/0203;H01L31/072;H01L31/18;(IPC1-7):H01L31/10 |
主分类号 |
H01L31/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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