| 摘要 |
PURPOSE: A method for fabricating a pilot lamp is provided to modularize an LED and a wire and to prevent thermal stress by performing an epoxy molding process for the LED and the wire. CONSTITUTION: A plurality of conductive films(5) having the predetermined size are installed in the predetermined interval. An LED is loaded on one side of the conductive film. The LED is adhered on the conductive film by using a conductive adhesive agent(2). The LED is bonded to the other side of the conductive film by using a wire(4). The LED and the conductive film are molded by using epoxy(6). A module of the LED and the conductive film is formed by performing the epoxy molding process for the LED and the conductive film. The module is mounted on a wiring member of a PCB(Printed Circuit Board)(3). The module is adhered on the wiring member by using a conductive adhesive. |
