发明名称 SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT, MULTI-LAYER PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING MULTI- LAYER PRINTED CIRCUIT BOARD
摘要 A transition layer 38 is provided on a die pad 22 of an IC chip 20 and integrated into a multilayer printed circuit board 10. Due to this, it is possible to electrically connect the IC chip 20 to the multilayer printed circuit board 10 without using lead members and a sealing resin. Also, by providing the transition layer 38 made of copper on an aluminum pad 24, it is possible to prevent a resin residue on the pad 24 and to improve connection characteristics between the die pad 24 and a via hole 60 and reliability. <IMAGE>
申请公布号 KR20030060898(A) 申请公布日期 2003.07.16
申请号 KR20037004202 申请日期 2003.03.22
申请人 发明人
分类号 H01L23/525;H05K3/46;H01L21/301;H01L21/60;H01L23/498;H01L23/538;H01R12/51;H05K1/18 主分类号 H01L23/525
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