WAFER PROBING DEVICE AND TEST HEAD DOCKING CONTROL METHOD

摘要

PURPOSE: A wafer probing device and a test head docking control method are provided to automatically control a docking location of a test head to a plurality of position limit switches which are installed at the test head. CONSTITUTION: A wafer(420) is installed at a wafer chuck(410). A probe card(500) is installed at an upper surface of a body(100). A test head(200) is provided at an upper portion of the body(100). A manipulator is installed at a side of the body(100). The manipulator rises and falls the test head(200). The manipulator controls docking location and height of the test head(200). The manipulator applies an electric signal to the test head(200). Position limit switches(300) sense a docking location of the test head(200) when the test head(200) falls. A down-limit switch(310) senses a docking height of the test head(200) when the test head(200) falls.