| 摘要 |
There is provided a multi-chip module which can vary functions of a memory chip at the time of loading or after loading, to the wiring board, the memory chip having formed an external connecting terminal with the wafer process. Two kinds of multi-chip modules having different functions such as word configuration and operation mode is realized using the identical memory chips by preparing for two kinds of module substrate of different patterns of wiring including the power supply voltage wiring and the ground potential wiring and then loading a memory chip and a control chip to these two kinds of module substrate. |
