CHEMICAL MECHANICAL POLISHING APPARATUS

摘要

PURPOSE: A CMP(Chemical Mechanical Polishing) apparatus is provided to be capable of preventing the malfunction of a pressure supplying part due to the heat of a motor installed at a head part of the CMP apparatus by installing a separating part between the motor and an electronic control circuit of the pressure supplying part. CONSTITUTION: A CMP apparatus is provided with a polishing head(11), a motor(13) connected to the polishing head for rotating the polishing head, a pressure supplying part(15) having an electronic control circuit(17) for supplying pressure to the polishing head, and a separating part installed for separating between the motor and the electronic control circuit. Preferably, the separating part includes the first cover(21) installed for storing the motor, the second cover(23) installed and spaced apart from the first cover for storing the electronic control circuit, and a heat insulator(25) installed between the first and second cover.