| 摘要 |
PURPOSE: An apparatus for polishing a plane of a semiconductor chip is provided to control effectively a state of a sample and a plane sampling time by controlling mechanically a polishing degree of the plane of the semiconductor chip. CONSTITUTION: An apparatus for polishing a plane of a semiconductor chip includes the first fixing portion(1), the second fixing portion(2), a target(3) of a plane sample, a polishing pad(4), and a pad guard(5). The first fixing portion is formed with a chip holding vacuum hole for fixing a plane sample of a semiconductor. The second fixing portion is formed with a chip holder for fixing the plane sample of the semiconductor. A semiconductor chip is used as the target of the plane sample. The pad guard is installed around the polishing pad.
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