发明名称 |
HEAT-RESISTANT RESIN PRECURSOR, HEAT-RESISTANT RESIN AND INSULATING FILM AND SEMICONDUCTOR DEVICE |
摘要 |
A precursor of a polybenzoxazole resin which comprises a crosslinking group in a molecule and has a specific structure, a polybenzoxazole resin obtained from the precursor by the condensation reaction and the crosslinking reaction, an insulating film comprising the polybenzoxazole resin and a semiconductor device comprising an insulating interlayer film in multi-layer wiring or a film for protecting surfaces which comprises the above insulating film. The precursor exhibits excellent processability due to excellent solubility in solvents and, after the ring closure, excellent heat stability in applications. The resin exhibits excellent electric, physical and mechanical properties and is advantageously used for insulating interlayer films of semiconductor devices and the like applications.
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申请公布号 |
EP1327653(A1) |
申请公布日期 |
2003.07.16 |
申请号 |
EP20010967764 |
申请日期 |
2001.09.20 |
申请人 |
SUMITOMO BAKELITE CO., LTD. |
发明人 |
OKANUMA, MASAKO;YOSHIDA, TATSUHIRO;SAITO, HIDENORI;HIGASHIDA, NOBUHIRO;FUJIMOTO, MASANORI;ISHIKAWA, TADAHIRO |
分类号 |
C08G73/22;H05K1/03;H05K3/28;H05K3/46;(IPC1-7):C08G73/22;H01B3/30;H01L21/768;H01L21/312 |
主分类号 |
C08G73/22 |
代理机构 |
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代理人 |
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地址 |
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