| 摘要 |
A package structure for an integrated circuit according to the present invention comprises tape carriers 1a - 1e, and a pin 22 vertically mounted on a wiring board 2. LSIs 12 are mounted on the tape carriers 1a - 1e respectively. The tape carriers 1a - 1e comprise base films 13 respectively. External connection terminals 11 are provided on the base film 13 in a lattice. The external connection terminal 11 comprises a through hole 18 and a conductive pattern 17 provided on the inner surface of the through hole 18. The pins 22 vertically mounted on the wiring board 2 are inserted into the external connection terminals 11 of the tape carriers 1a - 1e. The external connection terminals 11a - 11e are electrically connected by the pins 22. |
