CONNECTION SUBSTRATE, MULTILAYER WIRING BOARD USING THE CONNECTION SUBSTRATE, SUBSTRATE FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE, AND METHODS FOR MANUFACTURING THEM

摘要

The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them.